Display device having electrodes having sensor and auxilary sensor parts

ABSTRACT

Provided is a display device including a display panel and an input sensing unit. The input sensing unit includes at least one insulation layer, an electrode, and an auxiliary electrode. The electrode includes sensor parts including a metal and having a mesh shape and connection parts connecting adjacent sensor parts of the sensor parts to each other. The auxiliary electrode overlaps the sensor parts, is connected to the sensor parts, and includes transparent conductive oxide.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 16/595,115 filed on Oct. 7, 2019, which is adivisional application of U.S. patent application Ser. No. 15/804,758filed on Nov. 6, 2017 (now U.S. Pat. No. 10,474,295), which claimspriority under 35 USC § 119 to Korean Patent Application Nos.10-2016-0149800 filed on Nov. 10, 2016, and 10-2016-0178116 filed onDec. 23, 2016, the entire contents of which are hereby incorporated byreference.

BACKGROUND

The present disclosure herein relates to a display device, and moreparticularly, to a display device in which at least a portion of aninput sensing unit is directly disposed on a display panel.

Various display devices used in multimedia devices such as televisions,mobile phones, table computers, navigation devices, and game consolesare being developed. Such a display device includes a keyboard or amouse as an input unit. Also, in recent years, such a display deviceincludes a touch panel as an input unit.

SUMMARY

The present disclosure provides an input sensing unit-integrated displaydevice having improved sensitivity.

An embodiment of the inventive concept provides a display deviceincluding a display panel configured to provide a base surface and aninput sensing unit directly disposed on the base surface. The inputsensing unit includes at least one insulation layer, a first electrode,and a second electrode.

The first electrode includes first sensor parts having a metal and amesh shape, first connection parts configured to connect first sensorparts, which are adjacent to each other, of the first sensor parts, andfirst auxiliary sensor parts connected to the first sensor parts andincluding a transparent conductive oxide.

The second electrode includes second sensor parts having a metal and amesh shape, second connection parts configured to connect second sensorparts, which are adjacent to each other, of the second sensor parts andcrossing the first connection parts with the insulation layertherebetween, and second auxiliary sensor parts connected to the secondsensor parts and including a transparent conductive oxide.

In an embodiment, the display panel may include a plurality of emissionareas spaced apart from each other and a non-emission area disposedbetween the plurality of emission areas. The first sensor parts mayoverlap the non-emission area and include a plurality of mesh holescorresponding to the plurality of emission areas, and the firstauxiliary sensor parts may overlap the plurality of emission areas andthe non-emission area.

In an embodiment, a first sensor part of the first sensor parts and afirst auxiliary sensor part of the first auxiliary sensor parts, whichcorrespond to each other, overlap each other with the insulation layertherebetween, and the first sensor part of the first sensor parts andthe first auxiliary sensor part of the first auxiliary sensor parts,which correspond to each other, may be connected to each other through afirst contact hole passing through the insulation layer.

In an embodiment, the first connection parts may be disposed on one sideof the insulation layer, and the first sensor parts, the second sensorparts, and the second connection parts may be disposed on an other sideof the insulation layer.

In an embodiment, a first sensor part of the first sensor parts and asecond connection part of the second connection parts, which correspondto each other, may be connected to each other through a second contacthole passing through the insulation layer. The second sensor parts andthe second connection parts may have an integrated shape.

In an embodiment, the first connection parts may be disposed moreadjacent to the display panel than the first sensor parts, the secondsensor parts, and the second connection parts.

In an embodiment, the first auxiliary sensor parts may be disposed on asame layer as the first connection parts.

In an embodiment, the first connection parts may contact the firstauxiliary sensor parts.

In an embodiment, the first electrode may further include auxiliaryconnection parts configured to connect first auxiliary sensor parts,which are adjacent to each other, of the first auxiliary sensor parts.The first connection parts may overlap the auxiliary connection parts.

In an embodiment, the display device may further include a signal lineconnected to the first electrode. The signal line may include at leastone of a first line part connected to a first auxiliary sensor part ofthe first auxiliary sensor parts and a second line part connected to afirst sensor part of the first sensor parts.

In an embodiment, the first line part and the second line part may bedisposed with the insulation layer therebetween. The first line part andthe second line part may be connected to each other through contactholes passing through the insulation layer.

In an embodiment, the first auxiliary sensor parts and the secondauxiliary sensor parts may be disposed on the other side of theinsulation layer.

In an embodiment, the first sensor parts may contact the first auxiliarysensor parts, and the second sensor parts may contact the secondauxiliary sensor parts.

In an embodiment, the first auxiliary sensor parts may contact theinsulation layer and be disposed between the insulation layer and thefirst sensor parts.

In an embodiment, the first sensor parts may contact the insulationlayer and be disposed between the insulation layer and the firstauxiliary sensor parts.

In an embodiment, the second electrode may further include secondauxiliary connection parts configured to connect second auxiliary sensorparts, which are adjacent to each other, of the second auxiliary sensorparts.

In an embodiment, the second connection parts may be disposed inside thesecond auxiliary connection parts, in a plan view.

In an embodiment of the inventive concept, a display device includes adisplay panel and an input sensing unit disposed on the display panel.The input sensing unit includes at least one insulation layer, a firstelectrode, a second electrode, and auxiliary electrodes. The firstelectrode includes first sensor parts having a metal and a mesh shapeand first connection parts configured to connect first sensor parts,which are adjacent to each other, of the first sensor parts. The secondelectrode includes second sensor parts having a metal and a mesh shapeand second connection parts configured to connect second sensor parts,which are adjacent to each other, of the second sensor parts andcrossing the first connection parts with the insulation layertherebetween. The auxiliary electrodes are connected to overlapcorresponding sensor parts of the first sensor parts and second sensorparts and include transparent conductive oxide.

In an embodiment of the inventive concept, a display device includes adisplay panel including a plurality of emission areas spaced apart fromeach other and a non-emission area disposed between the plurality ofemission areas and an input sensing unit including a plurality ofelectrodes disposed on the display panel.

The plurality of electrodes includes sensor parts disposed to be spacedapart from each other, each of which includes a metal, and having a meshshape, auxiliary sensor parts connected to overlap corresponding sensorparts of the sensor parts and including transparent conductive oxide.The sensor parts include a plurality of mesh holes corresponding to theplurality of emission areas and overlapping the non-emission area. Theauxiliary sensor parts overlap the plurality of emission areas and thenon-emission area.

In an embodiment of the inventive concept, an input sensing unitincludes a noise shield electrode directly disposed on the base surfaceand includes a transparent conductive oxide, a first electrode disposedon the noise shield electrode and having a mesh shape, and a secondelectrode disposed on the noise shield electrode and crossing the firstelectrode. The first electrode and the second electrode overlap thenoise shield electrode on the base surface in a plan view.

In an embodiment of the inventive concept, an input sensing unitincludes a plurality of first electrodes directly disposed on the basesurface and having a mesh shape, a dummy electrode directly disposed onthe base surface between the plurality of first electrodes, a pluralityof second electrodes crossing the first electrodes on the base surface,an insulation layer between the plurality of first electrodes and theplurality of second electrodes, and an input sensing circuit. The inputsensing circuit is electrically connected to the plurality of firstelectrodes, the dummy electrodes, and the plurality of second inputelectrodes and detects noises and an external input, which are generatedin the dummy electrode by the display panel.

BRIEF DESCRIPTION OF THE FIGURES

The accompanying drawings are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification. The drawings illustrateexemplary embodiments of the inventive concept and, together with thedescription, serve to explain principles of the inventive concept. Inthe drawings:

FIG. 1A is a perspective view of a display device according to anembodiment of the inventive concept;

FIG. 1B is a cross-sectional view of the display device according to anembodiment of the inventive concept;

FIG. 2 is a cross-sectional view of a display module according to anembodiment of the inventive concept;

FIG. 3 is a plan view of a display panel according to an embodiment ofthe inventive concept;

FIG. 4 is an equivalent circuit diagram of a pixel according to anembodiment of the inventive concept;

FIG. 5 is an enlarged cross-sectional view of the display panelaccording to an embodiment of the inventive concept;

FIG. 6A is a cross-sectional view of an input sensing unit according toan embodiment of the inventive concept;

FIG. 6B is a plan view of the input sensing unit according to anembodiment of the inventive concept;

FIG. 7A is a plan view illustrating a first conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 7B is a partial plan view of the input sensing unit according to anembodiment of the inventive concept;

FIG. 7C is a plan view illustrating a second conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 7D is a partial plan view of the input sensing unit according to anembodiment of the inventive concept;

FIGS. 7E and 7F are cross-sectional views of the input sensing unitaccording to an embodiment of the inventive concept;

FIGS. 8A and 8B are plan views illustrating the first conductive layerof the input sensing unit according to an embodiment of the inventiveconcept;

FIG. 9A is a plan view illustrating the first conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 9B is a partial plan view of the input sensing unit according to anembodiment of the inventive concept;

FIG. 9C is a plan view illustrating the second conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 9D is a partial plan view of the input sensing unit according to anembodiment of the inventive concept;

FIGS. 9E and 9F are cross-sectional views of the input sensing unitaccording to an embodiment of the inventive concept;

FIG. 10 is a partial plan view of the input sensing unit according to anembodiment of the inventive concept;

FIG. 11 is a cross-sectional view of the input sensing unit according toan embodiment of the inventive concept;

FIG. 12A is a plan view of the input sensing unit according to anembodiment of the inventive concept;

FIG. 12B is a partial enlarged plan view of the input sensing unitaccording to an embodiment of the inventive concept;

FIGS. 12C, 12D, and 12E are partial cross-sectional views of the inputsensing unit according to an embodiment of the inventive concept;

FIG. 13A is a plan view of the display panel according to an embodimentof the inventive concept;

FIG. 13B is a cross-sectional view illustrating the input sensing unitaccording to an embodiment of the inventive concept;

FIG. 13C is a plan view of the input sensing unit according to anembodiment of the inventive concept;

FIG. 14A is a plan view illustrating a first conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 14B is a plan view illustrating a second conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 14C is a plan view illustrating a third conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 15A is a plan view illustrating a second conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 15B is an enlarged view of an area AA of FIG. 15A;

FIG. 15C is a plan view illustrating a third conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIGS. 16A, 16B, and 16C are cross-sectional views of a display deviceaccording to an embodiment of the inventive concept;

FIG. 17A is a cross-sectional view of the input sensing unit accordingto an embodiment of the inventive concept;

FIG. 17B is a plan view of the input sensing unit according to anembodiment of the inventive concept;

FIG. 17C is a cross-sectional view taken along line I-I′ of FIG. 17B;

FIG. 18A is a cross-sectional view of the input sensing unit accordingto an embodiment of the inventive concept;

FIG. 18B is a plan view illustrating a first conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 18C is a plan view illustrating a second conductive layer of theinput sensing unit according to an embodiment of the inventive concept;

FIG. 19 is a block diagram of an input sensing circuit according to anembodiment of the inventive concept;

FIGS. 20A, 20B, and 20C are perspective views of a display deviceaccording to an embodiment of the inventive concept;

FIGS. 21A and 21B are perspective views of a display device according toan embodiment of the inventive concept; and

FIG. 22 is a perspective view of a display device according to anembodiment of the inventive concept.

DETAILED DESCRIPTION

Hereinafter, embodiments of the inventive concept will be described withreference to the accompanying drawings. In this specification, it willalso be understood that when one component (or region, layer, portion)is referred to as being ‘on’, ‘connected to’, or ‘coupled to’ anothercomponent, it can be directly connected/coupled on/to the one component,or an intervening third component may also be present.

Like reference numerals refer to like elements throughout. Also, in thefigures, the thickness, ratio, and dimensions of components areexaggerated for clarity of illustration. The term “and/or” includes anyand all combinations of one or more of the associated listed items.

It will be understood that although the terms of first and second areused herein to describe various elements, these elements should not belimited by these terms. These terms are generally only used todistinguish one element from another. For example, a first elementreferred to as a first element in one embodiment can be referred to as asecond element in another embodiment. A singular representation mayinclude a plural representation unless it represents a definitelydifferent meaning from the context.

Also, ““under”, “below”, “above’, “upper”, and the like are used forexplaining relation association of components illustrated in thedrawings. The terms may be a relative concept and described based ondirections expressed in the drawings.

The meaning of ‘include’ or ‘comprise’ specifies a property, a fixednumber, a step, an operation, an element, a component or a combinationthereof, but does not exclude other properties, fixed numbers, steps,operations, elements, components or combinations thereof.

FIG. 1A is a perspective view of a display device DD according to anembodiment of the inventive concept. FIG. 1B is a cross-sectional viewof the display device DD according to an embodiment of the inventiveconcept. FIG. 2 is a cross-sectional view of a display module DMaccording to an embodiment of the inventive concept. FIGS. 1B and 2illustrate cross-sections defined by a second directional axis DR2 and athird directional axis DR3.

As illustrated in FIGS. 1A and 1B, a display surface IS on which animage IM is displayed is parallel to a surface that is defined by afirst directional axis DR1 and the second directional axis DR2. A normaldirection of the display surface IS, i.e., a thickness direction of thedisplay device DD is indicated as the third directional axis DR3. Afront surface (or top surface) and a rear surface (or bottom surface) ofeach of members is distinguished by the third directional axis DR3.However, directions indicated as the first to third directional axesDR1, DR2, and DR3 may be a relative concept and thus changed intodifferent directions. Hereinafter, the first to third directions may bedirections indicated by the first to third directional axes DR1, DR2,and DR3 and designated by the same reference numerals, respectively.

Although the display device DD having a planar display surface isillustrated in an embodiment of the inventive concept, the embodiment ofthe inventive concept is not limited thereto. The display device DD mayinclude a curved display surface or an integrated display surface (apolygonal pillar-type display surface) including a plurality of displayareas that indicate directions different from each other.

The display device DD according to this embodiment may be a flat rigiddisplay device. However, the embodiment of the inventive concept is notlimited thereto. For example, the display device according to anembodiment of the inventive concept may be a flexible display device DD.The display device DD according to an embodiment of the inventiveconcept may be applied for large-sized electronic devices such astelevisions and monitors and small and middle-sized electronic devicessuch as mobile phones, tablet PC, navigation units for vehicles, gameconsoles, and smart watches.

As illustrated in FIG. 1A, the display surface IS includes a displayarea DD-DA on which the image IM is displayed and a non-display areaDD-NDA that is adjacent to the display area DD-DA. The non-display areaDD-NDA may be an area on which an image is not displayed. FIG. 1Aillustrates icon images as an example of the image IM. For example, thedisplay area DD-DA may have a rectangular shape. The non-display areaDD-NDA may surround the display area DD-DA. However, the embodiment ofthe inventive concept is not limited thereto. For example, the displayarea DD-DA and the non-display area DD-NDA may be relatively designed inshape.

As illustrated in FIG. 1B, the display device DD includes a window unitWM and the display module DM. The display module DM and the window unitWM may be coupled to each other by using an optical transparent adhesionmember OCA. In an embodiment of the inventive concept, the opticaltransparent adhesion member OCA may be omitted, and the window unit WMmay be directly disposed on the display module DM.

The window unit WM includes a base film WM-BS and a light blockingpattern WM-BZ. The base film WM-BS may include a thin film glasssubstrate and/or a plastic film. The light blocking pattern WM-BZpartially overlaps the base film WM-BS. The light blocking pattern WM-BZmay be disposed on a rear surface of the base film WM-BS to define abezel area, i.e., the non-display area DD-NDA (see FIG. 1A) of thedisplay device DD.

The light blocking pattern WM-BZ may be a colored organic layer and, forexample, be formed in a coating manner. Although not separately shown,the window unit WM may further include a functional coating layerdisposed on a front surface of the base film WM-BS. The functionalcoating layer may include a fingerprint prevention layer, a reflectionprevention layer, and a hard coating layer.

As illustrated in FIG. 2, the display module DM includes a display panelDP and an input sensing unit ISU (or an input sensing layer). Thedisplay panel DP generates an image, and the input sensing unit ISUacquires coordinate information of an external input (a touch event).Although not separately shown, the display module DM according to anembodiment of the inventive concept may further include a protectionmember disposed on a bottom surface of the display panel DP and anantireflection member disposed on a top surface of the input sensingunit ISU.

The display panel DP may be an emission-type display panel. That is, theembodiment of the inventive concept is not limited to a kind of displaypanels. For example, the display panel DP may be an organic lightemitting display panel and a quantum-dot light emitting display panel.The organic light emitting display panel includes a light emitting layermade of an organic light emitting material. In the quantum-dot lightemitting display panel, a light emitting layer includes a quantum dotand a quantum rod. Hereinafter, the organic light emitting display panelwill be described as an example of the display panel DP.

The display panel DP includes a base layer SUB, a circuit device layerDP-CL disposed on the base layer SUB, a display device layer DP-OLED,and a thin film encapsulation layer TFE. Although not separately shown,the display panel DP may further include functional layers such as theantireflection layer, a reflective index adjusting layer, and the like.

The base layer SUB may include a flexible film. The base layer SUB mayinclude a plastic substrate, a glass substrate, a metal substrate, andan organic/inorganic composite substrate. The display area DD-DA and thenon-display area DD-NDA, which are described with reference to FIG. 1A,may be defined in the same manner on the base layer SUB.

The circuit device layer DP-CL includes at least one intermediateinsulation layer and a circuit device. The intermediate insulation layerincludes at least one intermediate inorganic film and at least oneintermediate organic film. The circuit device includes signal lines, adriving circuit of the pixel, and the like. The circuit device layerDP-CL may be formed through an insulation formation process usingdeposition and a patterning process of a conductive layer and/or asemiconductor layer through a photolithograph process.

The display device layer DP-OLED may include at least one organic lightemitting diode. The display device layer DP-OLED may further include anorganic film such as a pixel defining layer.

The thin film encapsulation layer TFE seals the display device layerDP-OLED. The thin film encapsulation layer TFE includes at least oneinorganic film (hereinafter, referred to as an encapsulation inorganicfilm). The thin film encapsulation layer TFE may further include atleast one organic film (hereinafter, referred to as an encapsulationorganic film). The encapsulation inorganic film protects the displaydevice layer DP-OLED against moisture/oxygen, and the encapsulationorganic film protects the display device layer DP-OLED against foreignsubstances such as dust particles. The encapsulation inorganic film mayinclude a silicon nitride layer, a silicon oxynitride layer, and asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.The encapsulation organic film may include an acrylic-based organiclayer, but the embodiment of the inventive concept is not limitedthereto.

In an embodiment of the inventive concept, the thin film encapsulationlayer TFE may be replaced with an encapsulation substrate. Theencapsulation substrate seals the display device layer DP-OLED.

The input sensing unit ISU may be directly disposed on a base surfaceprovided on the display panel DP. In this specification, the term“directly disposed” means that a component is formed through thecontinuous process except that the component adheres by using a separateadhesion layer. The base surface may be a top surface of the thin filmencapsulation layer TFE, i.e., a top surface of the encapsulationsubstrate. The base surface is not particularly limited, and thus, maybe the uppermost top surface of the display panel DP, which is formed bya continuous process.

That is to say, the sentence “a component A of the input sensing unitISU is directly disposed on the base surface” represents that “anadhesion layer/adhesion member is not disposed between the base surfaceand the component A on the cross-section of the display device”. Here,the base surface may be a top surface of the thin film encapsulationlayer TFE, i.e., a top surface of the encapsulation substrate. The basesurface is not particularly limited and may be the uppermost top surfaceof the display panel DP, which is formed by a continuous process.

In an embodiment of the inventive concept, the input sensing unit ISUmay be separately formed as a panel shape and then coupled to thedisplay panel DP through the adhesion layer. Since the input sensingunit ISU is directly disposed on the base surface provided on thedisplay panel DP, the base substrate of the input sensing unit may beomitted to reduce a thickness of the display device DD.

The input sensing unit ISU may have a multilayer structure. The inputsensing unit ISU may include a conductive layer having a single layer ormultilayer structure. The input sensing unit ISU may include at leastone insulation layer.

For example, the input sensing unit ISU may sense an external input in acapacitive manner. The embodiment of the inventive concept is notspecifically limited to the operation manner of the input sensing unitISU. In an embodiment of the inventive concept, the input sensing unitISU may sense an external input in an electromagnetic inductive couplingor pressure sensitive manner.

FIG. 3 is a plan view of the display panel DP according to an embodimentof the inventive concept. FIG. 4 is an equivalent circuit diagram of apixel PX according to an embodiment of the inventive concept. FIG. 5 isan enlarged cross-sectional view of the display panel DP according to anembodiment of the inventive concept.

FIG. 3 additionally illustrates a circuit board PCB electricallyconnected to the display panel DP. The circuit board PCB may be a rigidsubstrate or a flexible circuit board. The circuit board PCB may bedirectly coupled to the display panel DP or connected to the displaypanel DP through another circuit board.

A timing control circuit TC controlling an operation of the displaypanel DP may be disposed on the circuit board PCB. Also, an inputsensing circuit ISU-C controlling the input sensing unit ISU may bedisposed on the circuit board PCB. Each of the timing control circuit TCand the input sensing circuit ISU-C may be mounted on the circuit boardPCB in the form of an integrated chip.

The circuit board PCB includes circuit board pads PCB-P electricallyconnected to the display panel DP. Although not shown, the circuit boardPCB further includes signal lines connecting the circuit board padsPCB-P to the timing control circuit TC and/or the input sensing circuitISU-C.

As illustrated in FIG. 3, the display panel DP includes a display areaDM-DA and a non-display area DM-NDA on a plane. In the currentembodiment, the non-display area DM-NDA may be defined along an edge ofthe display area DM-DA. The display area DM-DA and the non-display areaDM-NDA of the display panel DP may correspond to the display area DD-DAand the non-display area DD-NDA of the display module DM of FIG. 1A,respectively. It is unnecessary that the display area DM-DA and thenon-display area DM-NDA of the organic light emitting display panel DPrespectively correspond to the display area DD-DA and the non-displayarea DD-NDA of the display apparatus DD. For example, the display areaDM-DA and the non-display area DM-NDA of the organic light emittingdisplay panel DP may be changed according to a structure/design of theorganic light emitting display panel DP.

The display panel DP may include a driving circuit GDC, a plurality ofsignal lines SGL, and a plurality of pixels PX. The plurality of pixelsPX are disposed on the display area DM-DA. Each of the pixels PXincludes an organic light emitting diode and a pixel driving circuitconnected to the organic light emitting diode. The driving circuit GDC,the plurality of signal lines SGL, and the pixel driving circuit may beprovided in the circuit device layer DP-CL of FIG. 2.

The driving circuit GDC, sometimes called the scan driving circuit GDC,may include a scan driving circuit. The scan driving circuit GDCgenerates a plurality of scan signals, and the plurality of scan signalsare successively outputted to a plurality of scan lines GL. The scandriving circuit GDC may further output other control signals to thedriving circuit of each of the pixels PX.

The scan driving circuit GDC may include a plurality of thin filmtransistors that are manufactured through the same process as thedriving circuit of the pixel PX, e.g., a low temperature polycrystallinesilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO)process.

The plurality of signal lines SGL includes the scan lines GL, data linesDL, a power line PL, and a control signal line CSL. The scan lines GLare respectively connected to corresponding pixels of the plurality ofpixels PX, and the data lines DL are respectively connected tocorresponding pixels PX of the plurality of pixels PX. The power line PLis connected to the plurality of pixels PX. The control signal line CSLmay provide control signals to the scan driving circuit GDC.

The display panel DP includes signal pads DP-PD connected to ends of thesignal lines SGL. The signal pads DP-PD may be a kind of circuit device.An area of the non-display area DM-NDA, on which the signal pads DP-PDare disposed, is defined as a pad area NDA-PD. Dummy pads ISU-DPDconnected to signal lines SL1-1 to SL1-5 and SL2-1 to SL2-4, which willbe described later may be further disposed on the pad area NDA-PD. Thesignal pads DP-PD and the Dummy pads ISU-DPD may be disposed on the samelayer through the same process as a scan line GL (see FIG. 5) and a dataline DL (see FIG. 5), which will be described later.

FIG. 4 illustrates an example of the pixel PX connected to one scan lineGL, one data line DL, and the power line PL. However, the embodiment ofthe inventive concept is not limited to the configuration of the pixelPX. For example, the pixel PX may be variously formed in configuration.

The organic light emitting diode OLED may be a top emission-type diodeor a bottom emission-type diode. The pixel PX includes a firsttransistor T1 (or a switching transistor), a second transistor T2 (or adriving transistor), and a capacitor Cst as the pixel driving circuitdriving the organic light emitting diode OLED. A first power voltageELVDD is provided to the second transistor T2, and a second powervoltage ELVSS is provided to the organic light emitting diode OLED. Thesecond power voltage ELVSS may be less than the first power voltageELVDD.

The first transistor T1 outputs a scan signal applied to the data lineDL in response to a scanning signal applied to the scan line GL,sometimes called the gate line GL. The capacitor Cst charges a voltageto correspond to the data signal received from the first transistor T1.

The second transistor T2 is connected to the organic light emittingdiode OLED. The second transistor T2 controls driving current flowingthrough the organic light emitting diode OLED to correspond to an amountof charges stored in the capacitor Cst. The organic light emitting diodeOLED emits light during a turn-on period of the second transistor T2.

FIG. 5 illustrates a partial cross-sectional view of the display panelDP corresponding to the equivalent circuit of FIG. 4. The circuit devicelayer DP-CL, the display device layer DP-OLED, and the thin filmencapsulation layer TFE are successively disposed on the base layer SUB.

The circuit device layer DP-CL includes at least one inorganic film, atleast one organic film, and a circuit device. The circuit device layerDP-CL may include a buffer layer BFL, a first intermediate inorganicfilm 10, and a second intermediate inorganic film 20, which areinorganic layers, and an intermediate organic film 30 that is an organiclayer.

The inorganic films may include silicon nitride, silicon oxynitride,silicon oxide, and the like. The organic film may include at least oneof an acrylic-based resin, a methacrylic-based resin, apolyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, or a perylene-basedresin. The circuit device includes conductive patterns and/orsemiconductor patterns.

The buffer layer BFL improves coupling force between conductive patternsor semiconductor patterns. Although not separately shown, a barrierlayer for preventing foreign substances from being introduced may befurther disposed on a top surface of the base layer SUB. The bufferlayer BFL and the barrier layer may be selectively disposed/omitted.

A semiconductor pattern OSP1 (hereinafter, referred to as a firstsemiconductor pattern) of the first transistor T1 and a semiconductorpattern OSP2 (hereinafter, referred to as a second semiconductorpattern) of the second transistor T2 are disposed on the buffer layerBFL. Each of the first and second semiconductor patterns OSP1 and OSP2may be selected from amorphous silicon, polysilicon, and a metal oxidesemiconductor.

The first intermediate inorganic film 10 is disposed on the firstsemiconductor pattern OSP1 and the second semiconductor pattern OSP2. Acontrol electrode GE1 (hereinafter, referred to as a first controlelectrode) of the first transistor T1 and a control electrode GE2(hereinafter, referred to as a second control electrode) of the secondtransistor T2 are disposed on the first intermediate inorganic film 10.The first and second control electrodes GE1 and GE2 may be manufacturedby the same photolithography process as the scan lines GL (see FIG. 4).

The second intermediate inorganic film 20 covering the first and secondcontrol electrodes GE1 and GE2 is disposed on the first intermediatelayer 10. An input electrode DE1 (hereinafter, referred to as a firstinput electrode) and an output electrode SE1 (hereinafter, referred toas a first output electrode) of the first transistor T1 and an inputelectrode DE2 (hereinafter, referred to as a second input electrode),and an output electrode SE2 (hereinafter, referred to as a second outputelectrode) of the second transistor T2 are disposed on the secondintermediate inorganic film 20.

The first input electrode DE1 and the first output electrode SE1 areconnected to the first semiconductor pattern OSP1 through first andsecond through-holes CH1 and CH2, which pass through the first andsecond intermediate inorganic films 10 and 20, respectively. The secondinput electrode SE2 and the second output electrode DE2 are connected tothe second semiconductor pattern OSP2 through third and fourththrough-holes CH3 and CH4, which pass through the first and secondintermediate inorganic films 10 and 20, respectively. According toanother embodiment of the inventive concept, portions of the first andsecond transistors T1 and T2 may be formed into a bottom gate structure.

The intermediate organic film 30 covering the first input electrode DE1,the second input electrode DE2, the first output electrode SE1, and thesecond output electrode SE2 is disposed on the second intermediateinorganic film 20. The intermediate organic film 30 may provide aplanation surface.

The display device layer DP-OLED is disposed on the intermediate organicfilm 30. The display device layer DP-OLED may include a pixel defininglayer PDL and the organic light emitting diode OLED. The pixel defininglayer PDL may include an organic material, like the intermediate organicfilm 30. A first electrode AE is disposed on the intermediate organicfilm 30. The first electrode AE is connected to the second outputelectrode SE2 through the fifth through-hole CH5 passing through theintermediate organic film 30. An opening OP is defined in the pixeldefining layer PDL. The opening OP of the pixel defining layer PDLextends to and exposes at least a portion of the first electrode AE.

The pixel PX may be disposed on a pixel area on a plane. The pixel areamay include an emission area PXA and a non-emission area NPXA that isadjacent to the emission area PXA. The non-emission area NPXA maysurround the emission area PXA. In the current embodiment, the emissionarea PXA may be defined to correspond to a portion of the firstelectrode AE exposed by the opening OP.

A hole control layer HCL may be commonly disposed on the emission areaPXA and the non-emission area NPXA. Although not particularly shown, acommon layer such as the hole control layer HCL may be commonly disposedon the plurality of pixels PX (see FIG. 3).

An emission layer EML is disposed on the hole control layer HCL. Theemission layer EML may be disposed on an area corresponding to theopening OP. That is, the emission layer EML may be formed to beseparated from each of the plurality of pixels PX. Also, the emissionlayer EML may include an organic material and/or an inorganic material.Although the patterned emission layer EML is illustrated as an examplein the current embodiment, the emission layer EML may be commonlydisposed on the plurality of pixels PX. Here, the emission layer EML mayemit white light. Also, the emission layer EML may have a multilayerstructure.

An electronic control layer ECL is disposed on the emission layer EML.Although not particularly shown, the electronic control layer ECL may becommonly disposed on the plurality of pixels PX (see FIG. 3).

A second electrode CE is disposed on the electronic control layer ECL.The second electrode CE is commonly disposed on the plurality of pixelsPX.

The thin film encapsulation layer TFE is disposed on the secondelectrode CE. The thin film encapsulation layer TFE is commonly disposedon the plurality of pixels PX. In the current embodiment, the thin filmencapsulation layer TFE directly covers the second electrode CE. In anembodiment of the inventive concept, a capping layer covering the secondelectrode CE may be further disposed between the thin film encapsulationlayer TFE and the second electrode CE. Here, the thin film encapsulationlayer TFE may directly cover the capping layer.

FIG. 6A is a cross-sectional view of the input sensing unit ISUaccording to an embodiment of the inventive concept. FIG. 6B is a planview of the input sensing unit ISU according to an embodiment of theinventive concept. FIG. 6A illustrates the second electrode CE and thethin film encapsulation layer TFE as the constitutions of the displaypanel DP (see FIG. 5).

As illustrated in FIG. 6A, the input sensing unit ISU include a firstconductive layer ISU-CL1, a first insulation layer ISU-IL1 (hereinafter,referred to as a first insulation layer), a second conductive layerISU-CL2, and a second insulation layer ISU-IL2 (hereinafter, referred toas a second insulation layer). In the current embodiment, the firstconductive layer ISU-CL1 may be directly disposed on the thin filmencapsulation layer TFE. The embodiment of the inventive concept is notlimited thereto. For example, another inorganic layer or organic layermay be further disposed between the first conductive layer ISU-CL1 andthe thin film encapsulation layer TFE. In the current embodiment, thesecond insulation layer ISU-IL2 may be omitted, and an optical member oran adhesion layer may be substituted for the protection function of thesecond insulation layer ISU-IL2.

Each of the first conductive layer ISU-CL1 and the second conductivelayer ISU-CL2 may have a single-layer structure or a multi-layerstructure in which a plurality of layers are stacked in the thirddirectional axis DR3. The conductive layer having the single-layerstructure may include a metal layer or a transparent conductive layer.The metal layer may be formed of molybdenum, silver, titanium, copper,aluminum, and an alloy thereof.

The transparent conductive layer may include transparent conductiveoxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zincoxide (ZnO), and indium tin zinc oxide (ITZO). In addition, thetransparent conductive layer may include PEDOT, a metal nano wire, andgraphene.

The conductive layer having the multilayer structure may includemultilayer metal layers. The multilayer metal layers may have a 3-layerstructure of titanium/aluminum/titanium. The conductive layer having themultilayer structure may include a metal layer or a transparentconductive layer. The conductive layer having the multilayer structuremay include a multilayer metal layer or a transparent conductive layer.

Each of the first and second conductive layers ISU-CL1 and ISU-CL2 mayinclude a plurality of patterns. Hereinafter, an example in which thefirst conductive layer ISU-CL1 includes first conductive patterns, andthe second conducive layer ISU-CL2 includes second conductive patternswill be described. Each of the first and second conductive patterns mayinclude electrodes and signal lines.

Each of the first and second insulation layers ISU-IL1 and ISU-IL2 maybe formed of inorganic or organic material. At least one of the first orsecond insulation layer ISU-IL1 or ISU-IL2 may include an inorganicfilm. The inorganic film may include at least one of oxide, titaniumoxide, silicon oxide, silicon oxide nitride, zirconium oxide, or hafniumoxide.

At least one of the first or second insulation layer ISU-IL1 or ISU-IL2may include an organic film. The organic film may include at least oneof an acrylic-based resin, a methacrylic-based resin, apolyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, or a perylene-basedresin.

As illustrated in FIG. 6B, the input sensing unit ISU may include firstelectrodes TE1-1 to TE1-5, first signal lines SL1-1 to SL1-5 connectedto the first electrodes TE1-1 to TE1-1, second electrodes TE2-1 toTE2-4, second signal lines SL2-1 to SL2-4 connected to the secondelectrodes TE2-1 to TE2-4, and sensing signal pads ISU-PD connecting thefirst signal lines SL1-1 to SL1-5 to the second signal lines SL2-1 toSL2-4. The first electrode TE1-1 to TE1-5 and the second electrode TE2-1to TE2-4 cross each other. The first electrodes TE1-1 to TE1-5 arearranged in the first direction DR1 and extend in the second directionDR2. The external input may be detected in a mutual capacitance manneror a self-capacitance manner. Although not shown in FIG. 6B, the inputsensing unit ISU may include at least one insulation layer.

The first signal lines SL1-1 to SL1-5 are connected to ends of the firstelectrodes TE1-1 to TE1-5, respectively. The second signal lines SL2-1to SL2-4 are connected to both ends of the second electrodes TE2-1 toTE2-4, respectively. In an embodiment of the inventive concept, thefirst signal lines SL1-1 to SL1-5 may also be connected to both ends ofthe first electrodes TE1-1 to TE1-5, respectively. In an embodiment ofthe inventive concept, each of the second signal lines SL2-1 to SL2-4may be connected to only one end of each of the second electrodes TE2-1to TE2-4.

In an embodiment of the inventive concept, the first signal lines SL1-1to SL1-5, the second signal lines SL2-1 to SL2-4, and the sensing signalpads ISU-PD may be replaced with a circuit board that is separatelymanufactured and then coupled. In an embodiment of the inventiveconcept, the sensing signal pads ISU-PD may be omitted, and the firstsignal lines SL1-1 to SL1-5 and the second signal lines SL2-1 to SL2-4may be connected to the dummy pads ISU-DPD of FIG. 3.

The first signal lines SL1-1 to SL1-5 and the second signal lines SL2-1to SL2-4 may have a two-layer structure as described later. The firstsignal lines SL1-1 to SL1-5 comprise first line portions SL1-11 toSL1-51 (see FIG. 7A) formed from the first conductive layer (ISU-CL1,see FIG. 6A) and second line portions SL1-12 to SL1-52 (see FIG. 7C)formed from a second conductive layer (ISU-CL2, see FIG. 6A). The secondsignal lines SL2-1 to SL2-4 comprise first line portions SL2-11 toSL2-41 (see FIG. 7A) formed from the first conductive layer (ISU-CL1,see FIG. 6A) and second line portions SL2-22 to SL2-42 (see FIG. 7C)formed from a second conductive layer ISU-CL2 (see FIG. 6A).

FIG. 7A is a plan view illustrating the first conductive layer ISU-CL1(see FIG. 6A) of the input sensing unit ISU according to an embodimentof the inventive concept. FIG. 7B is a partial plan view of the inputsensing unit ISU according to an embodiment of the inventive concept,and FIG. 7C is a plan view illustrating the second conductive layerISU-CL2 (see FIG. 6A) of the input sensing unit ISU according to anembodiment of the inventive concept. FIG. 7D is a partial plan view ofthe input sensing unit ISU according to an embodiment of the inventiveconcept. FIGS. 7E to 7F are cross-sectional views of the input sensingunit ISU according to an embodiment of the inventive concept. FIGS. 7Band 7D are enlarged views of areas corresponding to two first sensorparts SP1 and two second sensor parts SP2. FIGS. 7E to 7F arecross-sectional views taken along lines I-I′ and II-II′ of FIG. 6B.

According to an embodiment of the inventive concept, each of the firstelectrodes TE1-1 to TE1-5 includes first sensor parts SP1, firstconnection parts CP1, and first auxiliary sensor parts SSP1. Each of thesecond electrodes TE2-1 to TE2-4 includes second sensor parts SP2,second connection parts CP2, and second auxiliary sensor parts SSP2.

The first sensor parts SP1 are arranged in the second direction DR2, andthe second sensor parts SP2 are arranged in the first direction DR1.Each of the first connection parts CP1 connects the first sensor partsSP1 adjacent to each other, and each of the second connection parts CP2connects the second sensor parts SP2 adjacent to each other.

The first and second sensor parts SP1 and SP2 may include metals andhave mesh shapes. The first and second connection parts CP1 and CP2 mayalso include metals and have mesh shapes. The first and second auxiliarysensor parts SSP1 and SSP2 may be respectively connected to the firstand second sensor parts SP1 and SP2 and include transparent conductiveoxide. Hereinafter, the input sensing unit ISU according to anembodiment of the inventive concept will be described in more detailwith reference to the accompanying drawings.

As illustrated in FIGS. 7A, 7B, and 7E, the first and second auxiliarysensor parts SSP1 and SSP2 are disposed on the thin film encapsulationlayer TFE. Also, the first connection parts CP1 are disposed on the thinfilm encapsulation layer TFE. The first connection parts CP1 aredisposed between the first auxiliary sensor parts SSP1. In an embodimentof the inventive concept, the second connection parts CP2 instead of thefirst connection parts CP1 may be disposed on the thin filmencapsulation layer TFE.

The first and second auxiliary sensor parts SSP1 and SSP2 may be formedthrough a process different from that for forming the first connectionparts CP1. The first and second auxiliary sensor parts SSP1 and SSP2 maybe formed by patterning a transparent conductive oxide layers throughthe photolithograph process after the transparent conductive oxide layeris formed. The first connection parts CP1 may be formed by patterningmultilayer metal layers through the photolithograph process after themultilayer metal layers is formed. An order of forming the firstconnection parts CP1 and the auxiliary sensor parts SSP1 and SSP2 is notspecifically limited.

Referring to FIG. 7B, first contact holes CH10 through which the firstauxiliary sensor parts SSP1 are exposed, second contact holes CH20through which the first connection parts CP1 are exposed, and thirdcontact holes CH30 through which the second auxiliary sensor parts SSP2are exposed are defined in the first insulation layer ISU-IL1.

FIG. 7B illustrates a plurality of emission areas PXA-R, PXA-G, andPXA-B spaced apart from each other and a non-emission area NPXA disposedon the plurality of emission areas PXA-R, PXA-G, and PXA-B, sometimescalled red, green, and blue emission areas, respectively. The pluralityof emission areas PXA-R, PXA-G, and PXA-B may correspond to the emissionarea PXA described with reference to FIG. 5. An organic light emittingdiode generating red light may be disposed on the red emission areaRXA-R, an organic light emitting diode generating green light may bedisposed on the green emission area RXA-G, and an organic light emittingdiode generating blue light may be disposed on the blue emission areaPXA-B. An area of the emission area may be determined according to thecolor of the generated light.

The first and second auxiliary sensor parts SSP1 and SSP2 overlap theplurality of emission areas PXA-R, PXA-G, and PXA-B and the non-emissionarea NPXA. The first connection part CP1 and the contact holes CH10,CH20, and CH30 overlap the non-emission area NPXA.

As illustrated in FIGS. 7C, 7D, and 7E, the first and second sensorparts SP1 and SP2 overlapping the non-emission area NPXA are disposed onthe first insulation layer ISU-IL1. Also, the second connection partsCP2 are disposed on the first insulation layer ISU-IL1. The secondsensor parts SP2 and the second connection parts CP2, which are formedthrough the same photolithograph process may have an integrated shape. Aplurality of mesh holes ISU-OPR, ISU-OPG, and ISU-OPB are defined in thefirst and second sensor parts SP1 and SP2. The plurality of mesh holesISU-OPR, ISU-OPG, and ISU-OPB may one-to-one correspond to the emissionareas PXA-R, PXA-G, and PXA-B.

The first sensor part SP1 and the first auxiliary sensor part SSP1,which overlap each other, are connected to each other through the firstcontact holes CH10, and the second sensor part SP2 and the secondauxiliary sensor part SSP2, which overlap each other, are connected toeach other through the third contact holes CH30. The first sensor partSP1 and the first connection part CP1 are connected to each otherthrough the second contact holes CH20.

Although the mesh holes ISU-OPR, ISU-OPG, and ISU-OPB one-to-onecorrespond to the emission areas PXA-R, PXA-G, and PXA-B in the currentembodiment, the embodiment of the inventive concept is not limitedthereto. One mesh hole ISU-OPR, ISU-OPG, or ISU-OPB may correspond to atleast two emission areas PXA-R, PXA-G, and PXA-B.

Although the emission areas PXA-R, PXA-G, and PXA-B have various surfaceareas, the embodiment of the inventive concept is not limited thereto.The emission areas PXA-R, PXA-G, and PXA-B may have the same size, andalso, the mesh holes ISU-OPR, ISU-OPG, and ISU-OPB may have the samesize.

In an embodiment of the inventive concept, the constitutions of thefirst conductive layer ISU-CL1 may be exchanged with those of the secondconductive layer ISU-CL2. For example, the first sensor parts SP1, thesecond sensor parts SP2, and the second connection parts CP2 may bedisposed below the first insulation layer ISU-IL1, and the firstauxiliary sensor parts SSP1, the second auxiliary sensor parts SSP2, andthe first connection parts CP1 may be disposed above the insulationlayer ISU-IL1.

As illustrated in FIG. 7F, signal lines SL2-1 and SL2-2 include firstline parts SL2-11 and SL2-21 connected to the auxiliary sensor partscorresponding to the signal lines SL2-1 and SL2-2 and second line partsSL2-12 and SL2-22 connected to the corresponding sensor parts. Twosecond signal lines SL2-1 and SL2-2 are exemplarily illustrated in FIG.7F. Hereinafter, the descriptions with respect to the second signallines SL2-1 and SL2-2 may be equally applied to first signal lines SL1-1to SL1-5 (not shown).

The first line parts SL2-11 and SL2-21 and the second line parts SL2-12and SL2-22 may be connected to each other through a fourth contact holeCH40 passing through the first insulation layer ISU-IL1. Since the firstline parts SL2-11 and SL2-21 and the second line parts SL2-12 and SL2-22are connected to each other, the signal lines SL2-1 and SL2-2 may bereduced in resistance.

The first line parts SL2-11 and SL2-21 may be formed through the sameprocess as that for forming the second auxiliary sensor parts SSP2 (seeFIG. 7B). Thus, the first line parts SL2-11 and SL2-21 and the secondauxiliary sensor parts SSP2 (see FIG. 7B) may have an integrated shape,include the same material, and have the same stacked structure. Thesecond line parts SL2-12 and SL2-22 may be formed through the sameprocess as that for forming the second sensor parts SP2 (see FIG. 7D).Thus, the second line parts SL2-12 and SL2-22 and the second sensorparts SP2 (see FIG. 7D) may have an integrated shape, include the samematerial, and have the same stacked structure.

However, the signal lines SL2-1 and SL2-2 according to an embodiment ofthe inventive concept are not limited to the structure of FIG. 7F. Thesignal lines SL2-1 and SL2-2 have only to include at least one of thefirst line parts SL2-11 and SL2-21 or the second line parts SL2-12 andSL2-22. In an embodiment of the inventive concept, the first insulationlayer ISU-IL1 may not overlap the non-display area NDA (see FIG. 6B),and the first line parts SL2-11 and SL2-21 and the second line partsSL2-12 and SL2-22 may not directly contact each other.

In the input sensing unit ISU described with reference to FIGS. 7A to 7Faccording to an embodiment of the inventive concept, each of theelectrodes may include the auxiliary sensor parts connected to thesensor parts to increase a variation in capacitance. The variation incapacitance may be a difference in capacitance before and after thesensing event occurs. Since the variation in capacitance increases, theinput sensing unit ISU may even detect the fine sensing event.

In an embodiment of the inventive concept, one of the first and secondauxiliary sensor parts SSP1 and SSP2 may be omitted. Also, although thefirst and second auxiliary sensor parts SSP1 and SSP2 are included inthe corresponding electrode, the first and second auxiliary sensor partsSSP1 and SSP2 may be defined as a separate electrode (for example, anauxiliary electrode) that is distinguished from the electrode.

FIGS. 8A and 8B are plan views illustrating the first conductive layerof the input sensing unit ISU according to an embodiment of theinventive concept. Hereinafter, differences of the input sensing unitISU will be mainly described with reference to FIGS. 7A to 7F. FIGS. 8Aand 8B are plan views of a plane corresponding to FIG. 7B.

As illustrated in FIG. 8A, the connection part CP1 may contact the firstauxiliary sensor parts SSP1. Thus, the first electrode may be reduced inresistance. An order of stacking the first connection part CP1 and thefirst auxiliary sensor parts SSP1 is not specifically limited.

As illustrated in FIG. 8B, the first electrode may further include anauxiliary connection part SCP1 connecting the first auxiliary sensorparts SSP1 to each other. Also, the auxiliary connection part SCP1 mayoverlap the emission area PXA and the non-emission area NPXA. The firstauxiliary sensor parts SSP1 and the auxiliary connection part SCP1 maybe formed through the same process and have an integrated shape.

The first connection part CP1 overlaps the auxiliary connection partSCP1. The first connection part CP1 may be disposed inside the auxiliaryconnection part SCP1.

FIG. 9A is a plan view illustrating the first conductive layer of theinput sensing unit ISU according to an embodiment of the inventiveconcept. FIG. 9B is a partial plan view of the input sensing unit ISUaccording to an embodiment of the inventive concept. FIG. 9C is a planview illustrating the second conductive layer of the input sensing unitISU according to an embodiment of the inventive concept. FIG. 9D is apartial plan view of the input sensing unit ISU according to anembodiment of the inventive concept. FIGS. 9E to 9F are cross-sectionalviews of the input sensing unit ISU according to an embodiment of theinventive concept. Hereinafter, differences of the input sensing unitISU will be mainly described with reference to FIGS. 7A to 7F.

As illustrated in FIGS. 9A, 9B, and 9E, the first connection parts CP1are disposed on the thin film encapsulation layer TFE. The firstconnection parts CP1 overlap the non-emission area NPXA. The firstconnection parts CP1 do not overlap the emission areas PXA-R, PXA-G, andPXA-B. The second contact holes CH20 through which the first connectionpats CP1 are exposed are defined in the first insulation layer ISU-IL1.

As illustrated in FIGS. 9C, 9D, and 9E, the first sensor parts SP1, thesecond sensor parts SP2, and the connection parts CP2, which overlap thenon-emission area NPXA, are disposed on the first insulation layerISU-IL1. Also, the first auxiliary sensor parts SSP1 and the secondauxiliary sensor parts SSP2 are disposed on the first insulation layerISU-IL1.

In an embodiment of the inventive concept, the first auxiliary sensorparts SSP1 and the second auxiliary sensor parts SSP2 may be directlydisposed on the thin film encapsulation layer TFE. The first sensorparts SP1 and the second sensor parts SP2 are disposed on the firstauxiliary sensor parts SSP1 and the second auxiliary sensor parts SSP2,respectively. The first sensor parts SP1 may contact the first auxiliarysensor parts SSP1, and the second sensor parts SP2 may contact thesecond auxiliary sensor parts SSP2. The first and second auxiliarysensor parts SSP1 and SSP2 may contact the first insulation layerISU-IL1 and be disposed between the first insulation layer ISU-IL1 andthe first sensor parts SP1 and between the first insulation layerISU-IL1 and the second sensor parts SP2.

Each of outer edges of the first and second auxiliary sensor parts SSP1and SSP2 is disposed inside the corresponding sensor part. A portion ofthe first and second sensor parts SP1 and SP2 may not overlap thecorresponding auxiliary sensor part.

As illustrated in FIG. 9F, signal lines SL2-1 and SL2-2 include firstline parts SL2-11 and SL2-21 connected to the auxiliary sensor partscorresponding to the signal lines SL2-1 and SL2-2 and second line partsSL2-12 and SL2-22 connected to the corresponding sensor parts. The firstline parts SL2-11 and SL2-21 are disposed on the first insulation layerISU-IL, and the second line parts SL2-12 and SL2-22 are directlydisposed on the first line parts SL2-11 and SL2-21.

FIG. 10 is a partial plan view of the input sensing unit ISU accordingto an embodiment of the inventive concept. FIG. 11 is a cross-sectionalview of the input sensing unit ISU according to an embodiment of theinventive concept. Hereinafter, differences of the input sensing unitISU will be mainly described with reference to FIGS. 9A to 9F. FIG. 10illustrates a plan view corresponding to FIG. 9D, and FIG. 11illustrates a cross-sectional view corresponding to FIG. 9E.

As illustrated in FIG. 10, the second electrode may further include anauxiliary connection part SCP2 connecting the second auxiliary sensorparts SSP2 to each other. Also, the auxiliary connection part SCP2 mayoverlap the emission area PXA and the non-emission area NPXA. The secondauxiliary sensor parts SSP2 and the auxiliary connection part SCP2 maybe formed through the same process and have an integrated shape.

The second connection part CP2 overlaps the auxiliary connection partSCP2. The second connection part CP2 may be disposed inside theauxiliary connection part SCP2.

As illustrated in FIG. 11, the first sensor parts SP1 may be directlydisposed on the first insulation layer ISU-IL1. The first auxiliarysensor parts SSP1 are disposed on the first sensor parts SP1. The firstauxiliary sensor parts SSP1 may contact the first sensor parts SP1. Thefirst sensor parts SP1 are disposed between the first insulation layerISU-IL1 and the first auxiliary sensor parts SSP1.

Although not shown, the second sensor parts SP2 may also be directlydisposed on the thin film encapsulation layer TFE, like the first sensorparts SP1. The second auxiliary sensor parts SSP2 are disposed on thesecond sensor parts SP2. The second auxiliary sensor parts SSP2 maycontact the second sensor parts SP2. The second sensor parts SP2 aredisposed between the thin film encapsulation layer TFE and the secondauxiliary sensor parts SSP2.

The first auxiliary sensor parts SSP1 and the second auxiliary sensorparts SSP2 may completely cover or partially expose the first sensorparts SP1 and the second sensor parts SP2. Since the first auxiliarysensor parts SSP1 and the second auxiliary sensor parts SSP2 are formedlater than the first sensor part SP1 and the second sensor parts SP2,damage of the auxiliary sensor parts, which may occur during theformation process of the sensor parts, may be prevented from occurring.

FIG. 12A is a plan view of the input sensing unit ISU according to anembodiment of the inventive concept. FIG. 12B is a partial enlarged planview of the input sensing unit ISU according to an embodiment of theinventive concept. FIGS. 12C to 12E are partial cross-sectional views ofthe input sensing unit ISU according to an embodiment of the inventiveconcept. Hereinafter, detailed descriptions with respect to the sameconstituent as that described with reference to FIGS. 1 to 11 will beomitted.

As illustrated in FIG. 12A, the input sensing unit ISU may include aplurality of electrodes TE and a plurality of signal lines SL. Each ofthe plurality of electrodes TE has proper coordinate information. Forexample, the electrodes TE may be arranged in the form of a matrix andrespectively connected to the signal lines SL. The embodiment of theinventive concept is not particularly limited to the shape andarrangement of the electrodes TE. A portion of the signal lines SL maybe disposed on the display area DM-DA, and a portion of the signal linesSL may be disposed on the non-display area DM-NDA. The input sensingunit ISU may acquire coordinate information in a self-capacitancemanner.

As illustrated in FIG. 12B, the input sensing unit ISU may includeauxiliary sensor parts SSP respectively overlapping a plurality ofemission areas PXA-R, PXA-G, and PXA-B. Each of the auxiliary sensorparts SSP includes transparent conductive oxide. Each of the auxiliarysensor parts SSP are connected to the corresponding sensor part of thesensor parts SP.

The sensor parts SP overlap the non-emission area NPXA. The auxiliarysensor parts SSP overlap the non-emission area NPXA and the emissionareas PXA-R, PXA-G, and PXA-B.

As illustrated in FIG. 12C, the auxiliary sensor parts SSP may bedisposed on the thin film encapsulation layer TFE, and the sensor partsSP may be disposed on the first insulation layer ISU-IL1. The auxiliarysensor parts SSP and the sensor parts SP may be connected to each otherthrough contact holes CH120 passing through the first insulation layerISU-IL1.

Although not particularly shown, the signal lines SL of FIG. 12A mayinclude first line parts SL2-11 and SL2-21 and second lines parts SL2-12and SL2-22 as illustrated in FIG. 7F. The embodiment of the inventiveconcept is not limited thereto. For example, the signal lines SL haveonly to include at least one of the first line parts SL2-11 and SL2-21or the second line parts SL2-12 and SL2-22. The signal lines SL disposedon the display area DM-DA may overlap the non-emission area NPXA andhave a mesh shape.

As illustrated in FIG. 12D, the auxiliary sensor parts SSP may bedisposed on the first insulation layer ISU-IL1. The sensor parts SP maybe directly disposed on the auxiliary sensor parts SSP. The sensor partsSP may be disposed inside the auxiliary sensor parts SSP, and a portionof the sensor parts SP may be disposed outside the auxiliary sensorparts SSP. Although not particularly shown, the signal lines SL mayinclude first line parts SL2-11 and SL2-21 and second lines parts SL2-12and SL2-22 as illustrated in FIG. 7F.

As illustrated in FIG. 12E, the sensor parts SP may be disposed on thefirst insulation layer ISU-IL1. The auxiliary sensor parts SSP may bedirectly disposed on the sensor parts SP. The auxiliary sensor parts SSPmay completely cover the sensor parts SP or expose a portion of thesensor parts SP. Although not particularly shown, the signal lines SLmay include first line parts SL2-11 and SL2-21 and second lines partsSL2-12 and SL2-22, which are illustrated in FIG. 9F, but the stackedorder may be contrary thereto.

FIG. 13A is a plan view of the display panel DP according to anembodiment of the inventive concept. FIG. 13B is a cross-sectional viewillustrating the input sensing unit ISU according to an embodiment ofthe inventive concept. FIG. 13C is a plan view of the input sensing unitISU according to an embodiment of the inventive concept. FIG. 13Billustrates the second electrode CE and the thin film encapsulationlayer TFE as the constitutions of the display panel DP (see FIG. 5).Hereinafter, detailed descriptions with respect to the same constituentas that described with reference to FIGS. 1 to 12E will be omitted.

Referring to FIG. 13A, the circuit board PCB may include a first circuitboard pads PCB-P1 electrically connected to the display panel DP and asecond circuit board pads PCB-P2 electrically connected to the inputsensing unit ISU. Although not shown, the circuit board PCB furtherincludes first signal lines connecting the first circuit board padsPCB-P1 to the timing control circuit and/or the input sensing circuitISU-C and second signal lines connecting the second circuit board padsPCB-P2 to the input sensing circuit ISU-C.

In this embodiment, a portion of the first circuit board pads PCB-P1 maybe connected to one of first conductive patterns of the secondconductive layer ISU-CL2 and second conductive patterns of a thirdconductive layer ISU-CL3 of the input sensing unit ISU, which will bedescribed below. The second circuit board pads PCB-P2 may be connectedto the other of the first conductive patterns of the second conductivelayer ISU-CL2 and the second conductive patterns of the third conductivelayer ISU-CL3 of the input sensing unit ISU.

As illustrated in FIG. 13B, the input sensing unit ISU includes a firstconductive layer ISU-CL1, a first insulation layer ISU-IL1, a secondconductive layer ISU-CL2, the second insulation layer ISU-IL2, and athird insulation layer ISU-IL3. In this embodiment, the first conductivelayer ISU-CL1 may be directly disposed on the thin film encapsulationlayer TFE. The embodiment of the inventive concept is not limitedthereto. For example, another inorganic layer or organic layer of thedisplay panel DP may be further disposed between the first conductivelayer ISU-CL1 and the thin film encapsulation layer TFE. In thisembodiment, the third insulation layer ISU-IL3 may be omitted, and anoptical member or an adhesion layer may be substituted for theprotection function of the third insulation layer ISU-IL3.

The second conductive layer ISU-CL2 and the third conductive layerISU-CL3 of FIG. 13B may correspond to the first conductive layer ISU-CL1and the second conductive layer ISU-CL2 of FIG. 6A, respectively. Eachof the first conductive layer ISU-CL1 and the third conductive layerISU-CL3 may have a single layer structure or a multi-layer structure inwhich a plurality of layers are stacked in the third directional axisDR3. The conductive layer having the single layer structure may includea metal layer or a transparent conductive layer. The metal layer mayinclude molybdenum, silver, titanium, copper, aluminum, and an alloythereof. The transparent conductive layer may include transparentconductive oxide such as indium tin oxide (ITO), indium zinc oxide(IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO). In addition,the transparent conductive layer may include PEDOT, a metal nano wire,and graphene.

The conductive layer having the multilayer structure may includemultilayer metal layers. The multilayer metal layers may have a 3-layerstructure of titanium/aluminum/titanium. The conductive layer having themultilayer structure may include at least one metal layer and at leastone transparent conductive layer.

Each of the second and third conductive layers ISU-CL2 and ISU-CL3 mayinclude a plurality of patterns. Hereinafter, an example in which thesecond conductive layer ISU-CL2 includes first conductive patterns, andthe third conducive layer ISU-CL3 includes second conductive patternswill be described. Each of the first and second conductive patterns mayinclude electrodes and signal lines. The first conductive layer ISU-CL1includes an electrode having a surface area relatively larger than thatof each of the first and second conductive patterns. Detaileddescriptions of the first to third conductive layers ISU-CL1 to ISU-CL3will be described below.

Each of the first to third insulation layers ISU-IL1 to ISU-IL3 mayinclude an inorganic or organic material. At least one of the firstinsulation layer ISU-IL1 to third insulation layer ISU-IL3 may includean inorganic film. The inorganic film may include at least one of oxide,titanium oxide, silicon oxide, silicon oxide nitride, zirconium oxide,or hafnium oxide.

At least one of the first to third insulation layers ISU-IL1 to ISU-IL3may include an organic film. The organic film may include at least oneof an acrylic-based resin, a methacrylic-based resin, apolyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, or a perylene-basedresin.

As illustrated in FIG. 13C, the input sensing unit ISU may include anoise shield electrode ISU-SE, first electrodes TE-1 to TE1-5, firstsignal lines SL1-1 to SL1-5 connected to the first electrodes TE-1 toTE1-5, second electrode TE2-1 to TE2-4, second signal lines SL2-1 toSL2-4 connected to the second electrode TE2-1 to TE2-4, and sensingsignal pads ISU-PD connected to the first signal lines SL1-1 to SL1-5and the second signal lines SL2-1 to SL2-4.

The first electrode TE1-1 to TE1-5 and the second electrode TE2-1 andTE2-4 cross each other. The first electrodes TE1-1 to TE1-5 are arrangedin the first direction DR1 and extend in the second direction DR2. Theexternal input may be sensed in a mutual capacitance manner or aself-capacitance manner.

Each of the first electrodes TE1-1 to TE1-5 includes first sensor partsSP1 and first connection parts CP1. Each of the second electrodes TE2-1to TE2-4 includes second sensor parts SP2 and second connection partsCP2. Each of two first sensor parts, which are disposed on both ends, ofthe first sensor parts may have a size less by about ½ than that of thefirst senor part disposed at a center. Each of two second sensor parts,which are disposed on both ends, of the six second sensor parts SP2 mayhave a size less by about ½ than that of the second sensor part disposedat a center.

Although the first electrodes TE1-1 to TE1-5 and the second electrodesTE2-1 to TE2-4 according to an embodiment are illustrated in FIG. 13C,the embodiment of the inventive concept is not limited to the shape ofeach of the electrodes. In an embodiment of the inventive concept, aconnection part of each of the first electrodes TE1-1 to TE1-5 and thesecond electrodes TE2-1 to TE2-4 may have the same shape as that of thesensor part.

The first sensor parts SP1 are arranged in the second direction DR2, andthe second sensor parts SP2 are arranged in the first direction DR1.Each of the first connection parts CP1 connects the first sensor partsSP1, which are adjacent to each other, to each other, and each of thesecond connection parts CP2 connects the second sensor parts SP2, whichare adjacent to each other, to each other.

The first signal lines SL1-1 to SL1-5 are connected to ends of the firstelectrodes TE1-1 to TE1-5, respectively. The second signal lines SL2-1to SL2-4 are connected to both ends of the second electrodes TE2-1 toTE2-4, respectively. In an embodiment of the inventive concept, thefirst signal lines SL1-1 to SL1-5 may also be connected to both ends ofthe first electrodes TE1-1 to TE1-5, respectively. In an embodiment ofthe inventive concept, each of the second signal lines SL2-1 to SL2-4may be connected to only one end of each of the second electrodes TE2-1to TE2-4.

In an embodiment of the inventive concept, the first signal lines SL1-1to SL1-5, the second signal lines SL2-1 to SL2-4, and the sensing signalpads ISU-PD may be replaced with a circuit board that is separatelymanufactured and then coupled. In an embodiment of the inventiveconcept, the sensing signal pads ISU-PD may be connected to the dummypads ISU-DPD of FIG. 3. In an embodiment of the inventive concept, thesensing signal pads ISU-PD may be omitted, and the first signal linesSL1-1 to SL1-5 and the second signal lines SL2-1 to SL2-4 may bedirectly connected to the dummy pads ISU-DPD of FIG. 3.

FIG. 14A is a plan view illustrating the first conductive layer ISU-CL1of the input sensing unit ISU according to an embodiment of theinventive concept. FIG. 14B is a plan view illustrating the secondconductive layer ISU-CL2 of the input sensing unit ISU according to anembodiment of the inventive concept. FIG. 14C is a plan viewillustrating the third conductive layer ISU-CL3 of the input sensingunit ISU according to an embodiment of the inventive concept.

As illustrated in FIG. 14A, the first conductive layer ISU-CL1 mayinclude a noise shield electrode ISU-SE. The noise shield electrodeISU-SE is directly disposed on the thin film encapsulation layer TFE(see FIG. 13A). The noise shield electrode ISU-SE may have a surfacearea corresponding to the display area DM-DA. The noise shield electrodeISU-SE may overlap the plurality of pixels PX of FIG. 3 and also overlapthe emission area PXA and the non-emission area NPXA of FIG. 5. In anembodiment of the inventive concept, the noise shield electrode ISU-SEmay completely cover the display area DM-DA and overlap a portion of thenon-display area DM-NDA.

To prevent noises generated in the display panel from interfering withthe first electrodes TE1-1 to TE1-5 and the second electrodes TE2-1 toTE2-4, the first electrodes TE1-1 to TE1-5 and the second electrodesTE2-1 to TE2-4 may be disposed inside the noise shield electrode ISU-SEon the base surface. The noise shield electrode ISU-SE may completelyoverlap the first electrodes TE1-1 to TE1-5 and the second electrodesTE2-1 to TE2-4 on the base surface. When considering noise shieldefficiency, the noise shield electrode ISU-SE may overlap about 90% ormore of an area of at least the first electrodes TE1-1 to TE1-5 and thesecond electrodes TE2-1 to TE2-4. In an embodiment of the inventiveconcept, the noise shield electrode ISU-SE may include a plurality ofelectrodes spaced a distance of several mm from each other.

The noise shield electrode ISU-SE may receive a predetermined voltage.For example, the noise shield electrode ISU-SE may receive a groundvoltage. In an embodiment, the noise shield electrode ISU-SE may receivea voltage that is equal to that applied to the second electrodes TE2-1to TE2-4. Although not separately shown, a signal line providing apredetermined voltage to the noise shield electrode ISU-SE and a padpart may be disposed on the non-display area DM-NDA.

The noise shield electrode ISU-SE may include transparent conductiveoxide. The transparent conductive oxide may include indium tin oxide(ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zincoxide (ITZO).

As illustrated in FIG. 14B, the second conductive layer ISU-CL2 includesfirst connection parts CP1. Although not shown in FIG. 14B, the firstconnection parts CP1 are disposed on the first insulation layer ISU-IL1(see FIG. 13A). The first insulation layer ISU-IL1 may directly coverthe noise shield electrode ISU-SE, completely cover at least the displayarea DM-DA, and further overlap a portion of the non-display areaDM-NDA.

Each of the first connection parts CP1 may include a single-layered ormultilayered metal layer and have a mesh shape. The first connectionparts CP1 may overlap the non-emission area NPXA described withreference to FIG. 5 and may not overlap the emission area PXA describedwith reference to FIG. 5.

As illustrated in FIG. 14C, the third conductive layer ISU-CL3 includesfirst sensor parts SP1, second sensor parts SP2, and second connectionparts CP2. Also, the third conductive layer ISU-CL3 includes firstsignal lines SL1-1 to SL1-5, second signal lines SL2-1 to SL2-4, andsensing signal pads ISU-PD. Although not shown in FIG. 14C, the thirdconductive layer ISU-CL3 is disposed on the second insulation layerISU-IL2 (see FIG. 13A). The first sensor parts SP1 is connected to thefirst connection parts CP1 through contact holes passing through thesecond insulation layer ISU-IL2.

Each of the first sensor parts SP1, the second sensor parts SP2, and thesecond connection parts CP2 may include indium tin oxide (ITO), indiumzinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO).Each of the first signal lines SL1-1 to SL1-5, the second signal linesSL2-1 to SL2-4, and the sensing signal pads ISU-PD may include thetransparent conductive oxide or the single-layered or multilayered metallayer. In an embodiment of the inventive concept, each of the firstsensor parts SP1, the second sensor parts SP2, and the second connectionparts CP2 may also include a single-layered or multilayered metal layer.

FIG. 15A is a plan view illustrating the second conductive layer ISU-CL2of the input sensing unit ISU according to an embodiment of theinventive concept. FIG. 15B is an enlarged view of an area AA of FIG.15A. FIG. 15C is a plan view illustrating the third conductive layerISU-CL3 of the input sensing unit ISU according to an embodiment of theinventive concept.

Hereinafter, differences with respect to the input sensing unit ISU willbe mainly described with reference to FIGS. 14A and 14B. Although notseparately shown, the input sensing unit ISU according to thisembodiment includes a noise shield electrode ISU-SE corresponding tothat of FIG. 14A.

As illustrated in FIG. 15A, the second conductive layer ISU-CL2 includesfirst electrodes TE1-1 to TE1-5, first signal lines SL1-1 to SL1-5, andsensing signal pads ISU-PD. Each of the first electrodes TE1-1 to TE1-5may have a mesh shape. Each of the first sensor parts SP1 and the firstconnection parts CP1 may include metal and be formed through the sameprocess. Since each of the first electrodes TE1-1 to TE1-5 has the meshshape, parasitic capacitance with respect to the first conductive layerISU-CL1 (see FIGS. 13A and 14A) or the electrodes of the display panelDP (see FIG. 13A) may be reduced.

As illustrated in FIG. 15B, the first sensing parts SP1 do not overlapthe emission area PXA-R, PXA-G, PXA-B and overlap the non-light emittingarea NPXA. The emission areas PXA-R, PXA-G, and PXA-B may be defined tobe equal to the emission area PXA of FIG. 5. Mesh lines of the firstsensor part SP1 define a plurality of mesh holes ISU-OPR, ISU-OPG, andISU-OPB. That is to say, a plurality of mesh holes ISU-OPR, ISU-OPG, andISU-OPB are defined in the first sensor part SP1. A line width of eachof the mesh lines may range from several micrometers to severalnanometers. The plurality of mesh holes ISU-OPR, ISU-OPG, and ISU-OPBmay one-to-one correspond to the emission areas PXA-R, PXA-G, and PXA-B.

The emission areas PXA-R, PXA-G, and PXA-B are spaced apart from eachother, and the non-emission area NPXA is disposed between the emissionareas PXA-R, PXA-G, and PXA-B. Organic light emitting diodes OLED aredisposed on each of the emission areas PXA-R, PXA-G, and PXA-B. Theemission areas PXA-R, PXA-G, and PXA-B may be classified into severalgroups according to colors of light emitted from the organic lightemitting diodes OLED. FIG. 15B illustrates an example in which theemission areas PXA-R, PXA-G, and PXA-B are classified into three groupsaccording to the colors of light.

The emission areas PXA-R, PXA-G, and PXA-B may have different surfaceareas according to the colors of light emitted from a light emittinglayer EML of the organic light emitting diode OLED (see FIG. 5). Thesurface area of each of the emission areas PXA-R, PXA-G, and PXA-B maybe determined according to kinds of organic light emitting diodes.

The plurality of mesh holes ISU-OPR, ISU-OPG, and ISU-OPB may beclassified into several groups having surface areas different from eachother. The plurality of mesh holes ISU-OPR, ISU-OPG, and ISU-OPB may beclassified into three groups according to the corresponding emissionareas PXA-R, PXA-G, and PXA-B.

Although the mesh holes ISU-OPR, ISU-OPG, and ISU-OPB one-to-onecorrespond to the emission areas PXA-R, PXA-G, and PXA-B as describedabove, the embodiment of the inventive concept is not limited thereto.The plurality of mesh holes ISU-OPR, ISU-OPG, and ISU-OPB may one-to-onecorrespond to the emission areas PXA-R, PXA-G, and PXA-B.

Although the emission areas PXA-R, PXA-G, and PXA-B have various surfaceareas, the embodiment of the inventive concept is not limited thereto.The emission areas PXA-R, PXA-G, and PXA-B may have the same size, andalso, the mesh holes ISU-OPR, ISU-OPG, and ISU-OPB may have the samesize. Each of the mesh holes ISU-OPR, ISU-OPG, and ISU-OPB is notlimited to the planar shape, and thus, may have diamond shape and otherpolygonal shapes.

Although not separately shown, the second conductive patterns of thethird conductive layer ISU-CL3, which are described with reference toFIG. 14C, and the second conductive patterns of the third conductivelayer ISU-CL3, which will be described below, may overlap the emissionareas PXA-R, PXA-G, and PXA-B and the non-emission area NPXA, which arerespectively disposed therebelow.

As illustrated in FIG. 15C, the third conductive layer ISU-CL3 includessecond electrodes TE2-1 to TE2-4, second signal lines SL2-1 to SL2-4,and sensing signal pads ISU-PD. Unlike the input sensing unit ISUillustrated in FIGS. 14A to 14C, the contact holes may not be defined inthe second insulation layer ISU-IL2. This is done because the firstelectrodes TE1-1 to TE1-5 and the second electrodes TE2-1 to TE2-4 aredisposed with the second insulation layer ISU-IL2 therebetween.

The second electrodes TE2-1 to TE2-4 overlap the emission areas PXA-R,PXA-G, and PXA-B and the non-emission area NPXA, which are illustratedin FIG. 15B. At least the second electrodes TE2-1 to TE2-4 may includethe transparent conductive oxide such as indium tin oxide (ITO), indiumzinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO).The display surface IS (see FIG. 1A) may provide a moiré phenomenon, inwhich the second electrodes TE2-1 to TE2-4 having the mesh shape and thefirst electrodes TE1-1 to TE1-5 having the mesh shape are shown tooverlap each other, to a user staring at an oblique angle. On the otherhand, although the mesh-shaped second electrodes TE2-1 to TE2-4including the transparent conductive oxide overlap the mesh-shaped firstelectrodes TE1-1 to TE1-5, the moiré phenomenon does not occur.

One of the second signal lines SL2-1 to SL2-4 and the sensing signalpads ISU-PD may be formed through the same process as the secondelectrodes TE2-1 to TE2-4 or through a process different from that offorming the second electrodes TE2-1 to TE2-4. One of the second signallines SL2-1 to SL2-4 and the sensing signal pads ISU-PD may includetransparent conductive oxide or metal.

In an embodiment of the inventive concept, one of the second signallines SL2-1 to SL2-4 and the signal pads ISU-PD of the input sensingunit ISU may be formed on the first insulation layer ISU-IL1 through thesame process as the first signal lines SL1-1 to SL1-5 of FIG. 15A. Here,the second electrode TE2-1 to TE2-4 and the second signal lines SL2-1 toSL2-4 may be connected to each other through the contact hole passingthrough the second insulation layer ISU-IL2.

FIGS. 16A to 16C are cross-sectional views of the display device DDaccording to an embodiment of the inventive concept. Hereinafter,detailed descriptions with respect to the constituent duplicated withthat of the input sensing unit ISU described with reference to FIGS. 1to 15C will be omitted.

As illustrated in FIG. 16A, the display device DD include a window unitWM, an antireflection unit ARM, an input sensing unit ISU, and a displaypanel DP. Portion of the above-described constituents may be formedthrough a continuous process, and portions of the above-describedconstituents may be coupled to each other through an optical transparentadhesion member.

The input sensing unit ISU includes a first portion unit TSUI and asecond portion unit ISU2. The first portion unit ISU1 may include afirst conductive layer ISU-CL1, a first insulation layer ISU-IL1, asecond conductive layer ISU-CL2, and a second insulation layer ISU-IL2,which are described with reference to FIGS. 13A to 15C. The firstconductive layer ISU-CL1 may be directly disposed on the display panelDP. The first conductive layer ISU-CL1, the second conductive layerISU-CL2, and the second insulation layer ISU-IL2 may also be directlydisposed on the display panel DP through the continuous process. In thisembodiment, the display panel DP and the first portion unit TSUI, whichare coupled to each other, may be defined as the display module DM.

The first insulation layer ISU-IL1 may include an inorganic material,and the second insulation layer ISU-IL2 may include an organic material.The insulation layer made of the inorganic material may improve couplingforce between the first insulation layer ISU-IL1 and the firstconductive layer ISU-CL1 and have a uniform thickness. The insulationlayer made of the organic material may improve coupling force betweenthe second insulation layer ISU-IL2 and a first optical transparentadhesion member OCA1 and also improve flexibility of the first portionunit ISU1.

The display module DM and the antireflection unit ARM may be coupled toeach other through the first optical transparent adhesion member OCA1.The antireflection unit ARM may be a member for reducing reflexibilityof external light and include a phase retardation member and apolarization member. The phase retardation member may include a λ/2phase retardation member and/or a λ/4 phase retardation member. Each ofthe phase retardation member and the polarization member may include aflexible plastic film or liquid crystals arranged with a predeterminedarrangement. Each of the phase retardation member and the polarizationmember may further include a protection film.

The antireflection unit ARM may include color filters having the samecolor as that of light emitted from the organic light emitting diodedisposed on the emission area PXA. Also, the antireflection unit ARM mayinclude a destructive interference structure that destructs firstreflection light and second reflection light, which are reflected bylayers different from each other. The color filters and the destructiveinterference structure may be disposed on the base film.

The antireflection unit ARM and the second portion unit ISU2 may becoupled to each other through a second optical transparent adhesionmember OCA2. The second portion unit ISU2 and the window unit WM may becoupled to each other through a third optical transparent adhesionmember OCA3. The second portion unit ISU2 may include a base film BL andthe third conductive layer ISU-CL3 and the third insulation layerISU-IL3, which are described with reference to FIGS. 13A to 15C.

In this embodiment, each of the antireflection unit ARM and the firstand second optical transparent adhesion members OCA1 and OCA2 may havean insulative function for insulating the second conductive layerISU-CL2 from the third conductive layer ISU-CL3. In the input sensingunit ISU illustrated in FIGS. 16A to 16C, since it is difficult to forma contact hole passing through the antireflection unit ARM and theoptical transparent adhesion members OCA1, OCA2, and OCA3, the secondconductive layer ISU-CL2 may include the first conductive patterns ofFIG. 15A, and the third conductive layer ISU-CL3 may include the secondconductive patterns of FIG. 15C. The third conductive layer ISU-CL3 mayinclude the sensing signal pads ISU-PD of FIG. 15C, and the sensingsignal pads ISU-PD may be connected to the second circuit board padsPCB-P2 of FIG. 13A through a flexible circuit board.

As illustrated in FIG. 16B, the base film BL of the second portion unitISU2 of FIG. 16A may be omitted. The third conductive layer ISU-CL3 ofthe second portion unit ISU2 may be directly disposed on theantireflection unit ARM. The third insulation layer ISU-IL3 may bedirectly disposed on the antireflection unit ARM to cover the secondconductive patterns of the third conductive layer ISU-CL3. Thus, thesecond optical transparent adhesion member OCA2 may be omitted, unlikethe input sensing unit ISU of FIG. 16A.

As illustrated in FIG. 16C, the base film BL of the second portion unitISU2 of FIG. 16A may be omitted. The third conductive layer ISU-CL3 ofthe second portion unit ISU2 may be directly disposed on a bottomsurface of a base film WM-BS of the window unit WM. The third insulationlayer ISU-IL3 may be directly disposed on the bottom surface of the basefilm WM-BS to directly cover the second conductive patterns and a lightblocking pattern WM-BZ of the third conductive layer ISU-CL3.

The second optical transparent adhesion member OCA2 may couple the thirdinsulation layer ISU-IL3 to the antireflection unit ARM. Thus, the thirdoptical transparent adhesion member OCA3 may be omitted, unlike theinput sensing unit ISU of FIG. 16A.

FIG. 17A is a cross-sectional view of the input sensing unit ISUaccording to an embodiment of the inventive concept. FIG. 17B is a planview of the input sensing unit ISU according to an embodiment of theinventive concept. FIG. 17C is a cross-sectional view taken along lineI-I′ of FIG. 17A. Hereinafter, detailed descriptions with respect to thesame constituent as that described with reference to FIGS. 1 to 16C willbe omitted.

According to this embodiment, the third conductive layer ISU-CL3 and thethird insulation layer ISU-IL3 of FIGS. 13A to 16C may be omitted, andthe input sensing unit ISU may include a first conductive layer ISU-CL1,a first insulation layer ISU-IL1, a second conductive layer ISU-CL2, anda second insulation layer ISU-IL2.

The first conductive layer ISU-CL1 may include a noise shield electrodeISU-SE. The second conductive layer ISU-CL2 may include a plurality ofelectrodes TE, a plurality of signal lines SL, and sensing signal padsISU-PD. The first insulation layer ISU-IL1 covering the noise shieldelectrode ISU-SE is not illustrated in FIG. 17B.

Each of the plurality of electrodes TE has proper coordinateinformation. For example, the electrodes TE may be arranged in the formof a matrix and respectively connected to the sensing signal lines SL.The embodiment of the inventive concept is not particularly limited tothe shape and arrangement of the electrodes TE. A portion of the sensingsignal lines SL may be disposed on the display area DM-DA, and a portionof the sensing signal lines SL may be disposed on the non-display areaDM-NDA. The input sensing unit ISU may acquire coordinate information ina self-capacitance manner.

As illustrated in FIGS. 17B and 17C, the electrodes TE, sometimes calledthe sensing electrodes TE, may have a mesh shape. Although notparticularly shown, the sensing electrodes TE may overlap thenon-emission area NPXA, similar to the first sensing part SP1 of FIG.15B. The noise shield electrode ISU-SE may block noises generated fromthe electrodes of the display panel DP with respect to the sensingelectrodes TE.

Although not particularly shown, unlike the structure of FIG. 17A, thesecond conductive layer ISU-CL2 may not be continuously formed from thefirst insulation layer ISU-IL1. The antireflection unit ARM and theoptical transparent adhesion member OCA may be further disposed betweenthe second conductive layer ISU-CL2 and the first insulation layerISU-IL1. Similar to the third conductive layer ISU-CL3 of FIG. 16B, thesecond conductive layer ISU-CL2 may be directly disposed on theantireflection unit ARM. Similar to the third conductive layer ISU-CL3of FIG. 16C, the second conductive layer ISU-CL2 may be directlydisposed on the window unit WM.

FIG. 18A is a cross-sectional view of the input sensing unit ISUaccording to an embodiment of the inventive concept. FIG. 18B is a planview illustrating a first conductive layer ISU-CL10 of the input sensingunit ISU according to an embodiment of the inventive concept. FIG. 18Cis a plan view illustrating a second conductive layer ISU-CL20 of theinput sensing unit ISU according to an embodiment of the inventiveconcept. Hereinafter, detailed descriptions with respect to the sameconstituent as that described with reference to FIGS. 1 to 17C will beomitted.

The input sensing unit ISU according to this embodiment does not includethe first conductive layer ISU-CL1 and the first input insulation layerISU-IL1, which are illustrated in FIGS. 13A to 16C. As illustrated inFIG. 18A, the input sensing unit ISU according to this embodiment mayinclude the first conductive layer ISU-CL10 and the second conductivelayer ISU-CL20. The first conductive layer ISU-CL10 and the secondconductive layer ISU-CL20 may correspond to the second conductive layerISU-CL2 and third conductive layer ISU-CL3, which are illustrated inFIGS. 13A to 16C, respectively.

As illustrated in FIG. 18B, the first conductive layer ISU-CL10 mayinclude first electrodes TE1-1 to TE1-5, first signal lines SL1-1 toSL1-5, dummy electrodes DE-1 to DE-4, dummy signal lines SL3-1 to SL3-4,and sensing signal pads ISU-PD. The first electrode TE1-1 to TE1-5 andthe dummy electrodes DE-1 to DE-4 may be formed through the sameprocess, and thus may be made of the same material and have the samelayer structure.

The dummy electrodes DE-1 to DE-4 may be a mesh shape like the firstelectrodes TE1-1 to TE-5. Each of the first electrodes TE-1 to TE-5 mayinclude a mesh hole ISU-OP, and each of the dummy electrodes DE-1 toDE-4 may include a dummy mesh hole DE-OP. The dummy electrodes DE-1 toDE-4 formed through a process different from that of forming the firstelectrodes TE1-1 to TE1-5 may not have the mesh structure. Here, thedummy electrodes DE-1 to DE-4 may include transparent conductive oxide.

The dummy electrode DE-1 to DE-4 may extend in the second direction DR2and arranged in the first direction DR1. The dummy electrodes DE-1 toDE-4 may be respectively disposed between the first electrodes TE-1 toTE-5.

Although each of the dummy electrodes DE-1 to DE-4 has a bar shape witha width in the first direction DR1 in this embodiment, the embodiment ofthe inventive concept is not limited thereto. For example, each of thedummy electrodes DE-1 to DE-4 may be formed into the shape of each ofthe first electrodes TE-1 to TE-5 of FIG. 13B. The number of dummyelectrodes DE-1 to DE-4 is not limited. That is, the input sensing unitISU may include dummy electrodes having various numbers as long as onedummy electrode overlaps one of the second electrodes TE2-1 to TE2-4 onthe plane.

As illustrated in FIG. 18C, the second conductive layer ISU-CL20includes second electrodes TE2-1 to TE2-4, second signal lines SL2-1 toSL2-4, and sensing signal pads ISU-PD. To prevent the moiré phenomenonfrom occurring, the second electrodes TE2-1 to TE2-4 may includetransparent conductive oxide. Although each of the second electrodesTE2-1 to TE2-4 has a bar shape with a width in the second direction DR2,the embodiment of the inventive concept is not limited thereto.

As illustrated in FIG. 19, the display device DD (see FIG. 1B) includesan input sensing circuit ISU-C which is electrically connected to thefirst electrodes TE-1 to TE1-5, the dummy electrodes DE-1 to DE-4, andthe second electrodes TE2-1 to TE2-4. The input sensing circuit ISU-Cdetects noises generated in the dummy electrode DE-1 to DE-4 by thedisplay panel DP (see FIG. 1B) and detects an external input (e.g.,user's touch) generated from the outside of the window unit WM (see FIG.1B). As illustrated in FIG. 3, the input sensing circuit ISU-C may bemounted on the circuit board PCB in the form of an integrated chip.

The input sensing circuit ISU-C includes a signal providing circuitC-10, a noise detecting circuit C-20, and a coordinate informationcalculating circuit C-30. The signal providing circuit C-10 providesdetecting signals to the first electrodes TE1-1 to TE1-5. The detectingsignals may be an AC signals having different pieces of information.Here, the sentence “the detecting signals have the different pieces ofinformation” represents that the detecting signals have different piecesof time information, frequency information, and code information. Thedetecting signals modulated by time division multiple access may beactivated in different sections. The detecting signals modulated byfrequency division multiple access may have frequencies different fromeach other. The detecting signals modulated by code division multipleaccess may have different pieces of code information.

The noise detecting circuit C-20 detects noises from the dummyelectrodes DE-1 to DE-4. The noises interfering with the dummyelectrodes DE-1 to DE-4 in the display panel DP may be treated as noisesinterfering with the second electrodes TE2-1 to TE2-4 or noisescorresponding thereto in the display panel DP. The noise detectingcircuit C-20 may include low-pass filter that removes low-frequencycomponents of the detected noise signal.

The coordinate information calculating circuit C-30 receives the noisesignal from the noise detecting circuit C-20. The coordinate informationcalculating circuit C-30 receives sensing signals from the secondelectrode TE2-1 to TE2-4. The coordinate information calculating circuitC-30 compensates the sensing signal on the basis of the noise signal.

For example, the noise signal may be subtracted from the sensing signalto generate correction signals, and coordinate information of an inputpoint may be calculated based on the correction signals.

Although not particularly shown, unlike the structure of FIG. 18A, thesecond conductive layer ISU-CL20 of the input sensing unit ISU accordingto an embodiment of the inventive concept may not be continuously formedfrom the first insulation layer ISU-IL1. The antireflection unit ARM andthe optical transparent adhesion member OCA may be further disposedbetween the second conductive layer ISU-CL20 and the first insulationlayer ISU-IL1. Similar to the third conductive layer ISU-CL3 of FIG.16B, the second conductive layer ISU-CL2 may be directly disposed on theantireflection unit ARM. Similar to the third conductive layer ISU-CL3of FIG. 16C, the second conductive layer ISU-CL2 may be directlydisposed on the window unit WM.

Although not particularly shown, the input sensing circuit ISU-C of theinput sensing unit ISU, which is described with reference to FIGS. 13Ato 16C, may not include the noise detecting circuit C-20 when comparedto the input sensing circuit ISU-C of FIG. 19. The input sensing circuitISU-C of the input sensing unit ISU, which is described with referenceto FIGS. 13C to 16C, includes a signal providing circuit C-10 connectedto one of the first electrodes TE1-1 to TE-5 and the second electrodesTE2-1 to TE2-4 and a coordinate information calculating circuit C-30connected to the other of the first electrodes TE1-1 to TE-5 and thesecond electrodes TE2-1 to TE2-4. Particularly, the coordinateinformation calculating circuit C-30 may be connected to the secondelectrodes TE2-1 to TE2-4 that is spaced far from the display panel DPto reduce noises interfering with the sensing signals.

The input sensing circuit ISU-C of the input sensing unit ISU, which isdescribed with reference to FIGS. 17A to 17C, includes a signalproviding circuit C-10 and a coordinate information calculating circuitC-30. The signal providing circuit C-10 and the coordinate informationcalculating circuit C-30 are connected to the sensing electrodes TE indifferent sections. The input sensing circuit ISU-C of the input sensingunit ISU, which is described with reference to FIGS. 17A to 17C, mayfurther include a switching circuit for selectively connecting thesignal providing circuit C-10 and the coordinate information calculatingcircuit C-30 to the plurality of sensing electrodes TE.

FIGS. 20A to 20C are perspective views of a display device DD accordingto an embodiment of the inventive concept. FIGS. 21A and 21B areperspective views of a display device DD according to an embodiment ofthe inventive concept. FIG. 22 is a perspective view of a display deviceDD according to an embodiment of the inventive concept. Hereinafter,detailed descriptions with respect to the same constituent as thatdescribed with reference to FIGS. 1 to 19 will be omitted.

One of the input sensing units ISU described with reference to FIGS. 1to 19 may be applied to a flexible display device DD that will bedescribed below.

As illustrated in FIGS. 20A to 20C, the display device DD may include aplurality of areas defined according to the forms of operations. Thedisplay device DD may include a bending area BA that is bent on thebasis of a bending axis BX, a first non-bending area NBA1 that is notbent, and a second non-bending area NBA2 that is not bent. Asillustrated in FIG. 20B, the display device DD may be bent inward toallow the display surface IS of the first non-bending area NBA1 and thedisplay surface IS of the second non-bending area NBA2 to face eachother. As illustrated in FIG. 20C, the display device DD may be bentoutward to allow the display surface IS to be exposed to the outside.

In an embodiment of the inventive concept, the display device DD mayinclude a plurality of bending areas BA. In addition, the bending areasBA may be defined to corresponding to user's operation for manipulatingthe display device DD. For example, the bending areas BA may be definedin parallel to the first directional axis DR1 or defined in a diagonaldirection, unlike FIGS. 20B and 20C. The bending area BA may have avariable surface area that is determined according to a curvature radiusthereof. In an embodiment of the inventive concept, the display deviceDD may have a shape in which only an operation mode of FIGS. 20A and 20Bis repeated.

As illustrated in FIGS. 21A and 21B, the display device DD includes afirst non-bending area NBA1, a second non-bending area NBA2 spaced apartfrom the first non-bending area NBA1 in the first direction DR1, and abending area BA defined between the first non-bending area NBA1 and thesecond non-bending area NBA2. A display area DD-DA may be included inthe first non-bending area NBA1. Portions of a non-display area DD-NDArespectively correspond the second non-bending area NBA2 and the bendingarea BA, and a portion of the non-display area DD-NDA, which is adjacentto the display area DD-DA, is included in the first non-bending areaNBA1.

The bending area BA may be bent so that a bending axis BX is definedalong the second direction DR2 perpendicular to the first direction DR1.The second non-bending area NBA2 faces the first bending area NBA1. Eachof the bending area BA and the second non-bending area NBA2 may have awidth in the second direction DR2, which is less than that of the firstbending area NBA1. Although not separately shown, the display device DDof FIG. 1A may also include a bending area corresponding to the bendingarea BA.

As illustrated in FIG. 22, the display device DD may include threebending areas. When compared to the display device DD of FIG. 21B, twoedge areas of the first non-bending area NBA1, which face each other inthe second direction DR2, may be bent from a central area of the firstnon-bending area NBA1.

As described above, since the auxiliary sensor parts are connected tothe sensor parts, the variation in capacitance may increase. Thevariation in capacitance may be a difference in capacitance before andafter the touch event occurs. Since the variation in capacitanceincreases, the input sensing unit may even sense the fine touch event.

The noise shield electrode including the transparent conductive oxidemay shield the noises between the display panel and the electrodes ofthe input sensing unit. Therefore, the input sensing unit may beimproved in sensitivity.

The second electrode providing the sensing signal to the input sensingcircuit may be disposed far away from the display panel than the firstelectrode receiving the detecting signal to improve the sensitivity.This is done because the second electrode has relatively low noiseinterference with the display panel rather than the first electrode. Theintensity of the noise affecting the second electrode may be calculatedto compensate the sensing signal. Therefore, the sensitivity may beimproved.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the inventive concept. Thus,it is intended that the present disclosure covers the modifications andvariations of the inventive concept provided they come within the scopeof the appended claims and their equivalents.

Hence, the real protective scope of the inventive concept shall bedetermined by the technical scope of the accompanying claims.

What is claimed is:
 1. A display device comprising: a display panelcomprising a plurality of emission areas spaced apart from each otherand a non-emission area disposed between the plurality of emissionareas; and an input sensing unit comprising first and second electrodesdisposed on the display panel, wherein each of the first and secondelectrodes comprise: a sensor part having a metal and a mesh shape; anauxiliary sensor part having a transparent conductive oxide andelectrically connected to the sensor part, wherein the sensor partoverlaps a corresponding area of the non-emission area and comprise aplurality of holes, and the auxiliary sensor part overlaps the sensorpart, corresponding areas of the plurality of emission areas, and acorresponding area of the non-emission area.
 2. The display device ofclaim 1, wherein the input sensing unit further comprise an insulatinglayer disposed between the sensor part and the auxiliary sensor part,and the sensor part is connected to the auxiliary sensor part by acontact hole defined in the insulating layer.
 3. The display device ofclaim 2, wherein the auxiliary sensor part is disposed between thedisplay panel and the sensor part.
 4. The display device of claim 1,wherein the sensor part contacts the auxiliary sensor part.
 5. Thedisplay device of claim 4, wherein the display panel includes an organiclight emitting diode and a thin film encapsulation layer sealing theorganic light emitting diode, and the input sensing unit furthercomprise an insulating layer disposed between the thin filmencapsulation layer and the auxiliary sensor part.
 6. The display deviceof claim 5, wherein the auxiliary sensor part contacts the insulatinglayer.
 7. The display device of claim 1, wherein the auxiliary sensorpart covers the sensor part.
 8. The display device of claim 1, whereinthe input sensing unit further comprises a noise shield electrodedisposed under the sensor part and the auxiliary sensor part.
 9. Adisplay device comprising: a display panel comprising a plurality ofemission areas spaced apart from each other and a non-emission areadisposed between the plurality of emission areas; and an input sensingunit comprising first and second electrodes disposed on the displaypanel, wherein each of the first and second electrodes comprise: asensor part having a metal and a mesh shape; an auxiliary sensor parthaving a transparent conductive oxide and electrically connected to thesensor part, wherein the sensor part overlaps a corresponding area ofthe non-emission area and comprise a plurality of holes, and theauxiliary sensor part overlaps the sensor part, corresponding areas ofthe plurality of emission areas, and a corresponding area of thenon-emission area, wherein the auxiliary sensor part covers the sensorpart, wherein the display panel includes an organic light emitting diodeand a thin film encapsulation layer sealing the organic light emittingdiode, the input sensing unit further comprise an insulating layerdisposed on the thin film encapsulation layer, and each of the auxiliarysensor part and the sensor part contacts the insulating layer.
 10. Thedisplay device of claim 1, wherein the first and second electrodes havea substantially same shape each other.
 11. The display device of claim1, wherein the input sensing unit further comprises first and secondsignal lines electrically connected to the first and second electrodes,respectively.
 12. The display device of claim 11, wherein each of thefirst and second signal lines overlaps a corresponding area of thenon-emission area.
 13. The display device of claim 11, wherein each ofthe first and second signal lines has a mesh shape.
 14. A display devicecomprising: a display panel comprising a plurality of emission areasspaced apart from each other and a non-emission area disposed betweenthe plurality of emission areas; and an input sensing unit comprisingfirst and second electrodes disposed on the display panel, wherein eachof the first and second electrodes comprise: a sensor part having ametal and a mesh shape; an auxiliary sensor part having a transparentconductive oxide and electrically connected to the sensor part, whereinthe sensor part overlaps a corresponding area of the non-emission areaand comprise a plurality of holes, and the auxiliary sensor partoverlaps the sensor part, corresponding areas of the plurality ofemission areas, and a corresponding area of the non-emission area,wherein the input sensing unit further comprises a noise shieldelectrode disposed under the sensor part and the auxiliary sensor part,wherein the display panel includes an organic light emitting diode and athin film encapsulation layer sealing the organic light emitting diode,and the noise shield electrode contacts the thin film encapsulationlayer.